[Dsg-eic_tracker] 2/28 Silicon Consortium Meeting

[Brian Eng]

I brought up that what we really need is a higher temperature in the meeting and I think what Nikki's (and it's probably from the ITS3 folks as well) concern isn't really just the adhesive itself, but the CTE of the assembly. Still, I would think they need to investigate other adhesives in any case to find one that has better properties, more flexible maybe?

So they'll need to do more studies in any event so I think (hope?) a lot of this is just laying the foundation for that.

Never the less it is still good that they're getting similar results as Pablo already has.



I still think even getting the center of the beampipe to 100C is going to be a big challenge and that the temperature of some of the other sections is going to be significantly hotter, which might impact other detectors than just tracking.

________________________________
From: Aschenauer, Elke
Sent: Tuesday, February 28, 2023 5:17 PM
To: Brian Eng
Cc: Aschenauer, Elke; dsg-eic_tracker at jlab.org
Subject: [EXTERNAL] Re: [Dsg-eic_tracker] 2/28 Silicon Consortium Meeting

Dear Brian,

indeed this looks to me reinventing the wheel. Should one not put more effort on the adhesive and find one which can stand a higher temperature.

Cheers elke

On Feb 28, 2023, at 14:02, Brian Eng via Dsg-eic_tracker <dsg-eic_tracker at jlab.org<mailto:dsg-eic_tracker at jlab.org>> wrote:

Might be of interest of others, the slides from Berkley of their both physical setup and Ansys simulations on the beampipe and cooling.

https://indico.bnl.gov/event/18525/contributions/73665/subcontributions/2266/attachments/46250/78235/Apadula_EICSC_2_28_23.pdf

As CliffsNotes it all pretty much matches up with the results we've found so far.
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