[Hallb_svt] SVT Meeting Minutes for Wednesday, September 2, 2009

[Peter Bonneau]

SVT Meeting Minutes: Wednesday, September 2, 2009


Present: Amrit Yegneswaran, J.J. Robertson, Peter Bonneau, Saptarshi Mandal

• Discussion on the silicon RFI.  On the due-date for the silicon sensor 
RFI, we had not received any responses. Contacted procurement about the 
lack of interest.  They emailed Micron again and apparently the first 
RFI was automatically sent to their spam filter. Micron said they are 
interested and will look at the RFI and respond.

• Contacted Hamamatsu regarding the sensors. They had received the RFI 
and had tried unsuccessfully to contact procurement regarding the 
sensors. I gave them the details about the project and cleared up their 
confusion regarding the intent of the RFI which is to express interest 
in supplying the sensors and it is not a RFQ. I requested that they send 
an email ASAP expressing their interest (for the upcoming review).

• Discussion on the SVT assembly drawing by JJ / Saptarshi.  Drawing 
showed mounted SVT modules (staves) in the support structure. Additional 
drawings are underway for the review.

• Amrit gave an overview on the different layers that compose a SVT 
module assembly. Different (~4) types of glue are needed for assembly. 
The various combinations of thermal and electrical conductivity are 
required for the design.

• Discussion on the copper block within the SVT Module. The copper 
should end ~ 1-2 mm past the FSSR2 ASIC on the hybrid.