[Hbi-svt] June 8th Video Conference with MSU

[Marc McMullen]

Hi All,

I am writing to inform all interested parties of the progress/status of 
the collaboration effort between Hall B Instrumentation and Moscow State 
University as it pertains to the SVT readout electronics.

Michael Merkin is looking into the process of incorporating the Hybrid 
Flex Circuit Board into MSU's module assembly process. He has not 
indicated that the HBI's current design is incompatible with the 
assembly process. Therefore we are proceeding with the design.

A design has been provided to MSU for the use of testing multiple 
sensors wire bonded together (Hybrid_Testboard). This design could not 
be manufactured in Russia. We have suggested that they (MSU) use the 
current ASIC test board designed by Brian Eng. A second option is to a 
new ASIC test pcb which is being manufactured currently. A third option 
is to wait until the HFCB design is completed and manufactured. Michael 
has indicated that the third option is his preference,  this indicates 
that the full chain test will not be completed before the next review.

Thanks
Marc McMullen
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