[Hbi-svt] Fwd: Data sheet

Brian Eng beng at jlab.org
Fri Jun 17 09:54:18 EDT 2011


For those that were curious about the glass being used for the pitch adapters …

Begin forwarded message:

> From: Miguel Ullan <miguel.ullan at imb-cnm.csic.es>
> Date: June 17, 2011 6:29:05 AM EDT
> To: Brian Eng <beng at jlab.org>
> Subject: Data sheet
> 
> Dear Brian,
> 
> Please, find attached the data sheet for the fused silica wafers we will use as substrate for the fabrication.
> 
> Regards,
> 
> Miguel.
> 
> -- 
> ------------------------------------------------------
> Miguel Ullan
> 
> Centro Nacional de Microelectrónica (IMB-CNM,CSIC)
> Campus Universitario Bellaterra
> 08193 Barcelona
> SPAIN
> Tf: + 34 93 594 7700 ext. 2203
> Fax: + 34 93 580 1496
> Miguel.Ullan at imb-cnm.csic.es
> http://www.cnm.es/
> ------------------------------------------------------
> 
-------------- next part --------------
A non-text attachment was scrubbed...
Name: Nikon Properties.pdf
Type: application/pdf
Size: 138323 bytes
Desc: not available
Url : https://mailman.jlab.org/pipermail/hbi-svt/attachments/20110617/7bebd8b8/attachment-0001.pdf 
-------------- next part --------------



More information about the Hbi-svt mailing list