[Hbi-svt] Fwd: GDS file of PA

[Saptarshi Mandal]

Hi Brian,

My concern with the PA design is the size of it  -- 42.450 mm x 4.012 
mm.  Mostly the concern is  42.450 mm part of it. This is  significantly 
bigger than the backing structure which has a dimension of 42.195 mm +/- 
0.075 mm. It would need a significant drawing change to our backing 
structure and module drawings to accommodate a larger PA which we would 
definitely like to avoid. Also with a wider PA, the module will have to 
be placed radially outward than with original dimensions.

It would also be good to have the tolerances on the size of the PA and 
also the accuracy of the cut edges. What is the thickness of the PA ?

Thanks.
Saptarshi

Brian Eng wrote:
> Hi All,
>
> Here's their first iteration of the pitch adapter.
>
> The files are available publicly here: http://clasweb.jlab.org/instrumentation/SVT/CAD/pitch_adapter/
> Also on the M drive here: M:\hallb_inst_svt\_1SVT Latest Documents\pitch adapter
>
> Please send me any comments/concerns you have regarding the design so that I can compile and forward them to Miguel as well as forwarding this email to anyone else you think should review it.
>
> Thanks
> Brian
>
> Begin forwarded message:
>
>   
>> From: Miguel Ullan <miguel.ullan at imb-cnm.csic.es>
>> Date: June 23, 2011 10:14:00 AM EDT
>> To: Brian Eng <beng at jlab.org>
>> Subject: GDS file of PA
>>
>> Dear Brian,
>>
>> Find attached the gds file containing the first iteration on the design of the pitch adapter. Also I attach the layers conversion table in case is of use to you. Please, have a close look at it and let me know if everything is all right or if you see any problem. I have a few comments about it:
>>
>> - On the detector pads I have increased the metal width so that the passivation opening can be 60 microns with a metal overlap of 5 microns
>> - On the chip side I cannot do this because the room is too tight, so I have reduced the metal overlap with respect to passivation opening to 3 microns. This way the passivation opening has a width of 54 microns.
>> - The total size of the PA is 42.450 x 4.012 mm2
>> - the minimum separation of the tracks is 30 microns and the minimum track width is 20 microns, apart from the space between chip pads where the metal track is 13 microns.
>> - I have made two bias lines of 200 microns width and at a minimum of 500 microns distance of the tracks. I didn't know very well where to put their pads at the chip side, so I placed them at 3.6 mm of the pads by looking at the hybrid design.
>> - As the fiducial is 220 microns wide, when its center it is placed at 200 microns of the PA edge, the border of the fiducial is at 80 microns of the physical edge. This is a bit too tight and I would prefer to place the fiducials at more distance (300?). We always play safe and never place anything at less than 200 microns from the edge, but in this case, as it is not an electronic device, only a metal layer, I do not think there will be any problem.
>> - There is a big metal sheet at the center of the PA. This is to facilitate the metal etching and enhance the quality by reducing the amount of metal to be removed. We would place more metal sheets at the other big empty spaces. They are always at more than 300 microns from any track, so there should not be any electric field problem (breakdown), but let me know if you think they can create any other problem to you.
>>
>> Please, let me know if you see anything wrong or different from what you expected.
>>
>> Kind Regards,
>>
>> Miguel.
>>
>> -- 
>> ------------------------------------------------------
>> Miguel Ullan
>>
>> Centro Nacional de Microelectrónica (IMB-CNM,CSIC)
>> Campus Universitario Bellaterra
>> 08193 Barcelona
>> SPAIN
>> Tf: + 34 93 594 7700 ext. 2203
>> Fax: + 34 93 580 1496
>> Miguel.Ullan at imb-cnm.csic.es
>> http://www.cnm.es/
>> ------------------------------------------------------
>>
>>     
>
>
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