[Jlab-seminars] Richard Younger - Presentation - Multi-use advanced digital readouts using 3D stacking 4/18 @ 1:30 PM

[Jennifer Finch]

You are invited to attend the presentation on 4/18 in L102 at 1:30 from Richard Younger of MIT-LL. Follow up discussion will be held in F224/225. This is in person only.

Recent advances in semiconductor 3D integration technology could enable modularity in sensors: An advanced digital chip may be combined with a separately fabricated analog detector front end and a separate detector. This technology will enable common use of highly capable but expensive digital components across sensing mode (imaging, photon counting, photon timing, etc) and wave band (gamma through LWIR). We report on recent efforts to produce an advanced digital imaging platform in an advanced (14nm) CMOS process as part of the DARPA ReImagine program. We give an overview of status and capabilities of the two digital chips produced to date, organized on Field Programmable Gate Array (FPGA) and System on a Chip (SoC) architectures respectively. We hope to spark a community discussion about potential uses of advanced digital circuitry and digital 3D integration for HEP sensing modalities such as self-triggering, photon counting and timing, and computational imaging.

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Jennifer McAllister

She/Hers/Her   INFJ-T

Administrative Support - Physics Division

Thomas Jefferson National Accelerator Facility www.jlab.org<https://www.jlab.org/>

757-269-7151 | finch at jlab.org<mailto:finch at jlab.org>

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