[Halld-cal] Material and socket (fwd from Fernando)

[Elton Smith]

---------- Forwarded message ----------
Date: Thu, 17 Jun 2010 10:46:45 -0400
From: Fernando J. Barbosa <barbosa at jlab.org>
To: Serguei Kuleshov <serguei at jlab.org>
Cc: Elton Smith <elton at jlab.org>, Fernando J. Barbosa <barbosa at jlab.org>
Subject: Material and socket

Hi Serguei,

The SiPM package material is Al2O3 with the following thermal properties:
CTE = 7ppm/K, Thermal Conductivity = 18W/mK.

I have tentatively chosen a Mill-Max socket (series 853) to be used with the 
Hamamatsu arrays I have attached a pdf. These are sold as strips off the shelf 
and you have to cut to length. You will need 11 x 2 for each side of the array 
pins.

Best regards,
Fernando
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