[Hbi-svt] Multiple scattering from copper

[David Kashy]

Hi All,
I have looked at the two layouts (Rev 4 and Rev 5 of the BST Layout) 
Just using a ruler, it seems there is another option that should be 
simulated. If we take the two wafer design from Rev 4 inner layer and 
use it for R2 then we get the most compact BST. This gives the most 
rigid device since R1 and R2 are both short. R3 must be long, or we 
loose too much acceptance. It may be that we dont' quite get to 124 
degrees, but I'm not sure if this is a requirement.

So can we simulate the effect of having copper very close to the 124 
degree line as a 3rd case.

Thanks
Dave


Marc McMullen wrote:
> Hi Maurizio,
>
> I have a couple of questions concerning simulating the effects of 
> different cooling materials as it pertains to the multiple scattering 
> (M.S.) effect on the central detector components. We would like to 
> have a material which will both efficiently remove the heat load 
> produced by the ASICs of the SVT and while minimizing M.S. effect.  
> Amrit  has pointed me in your direction. What would you need to do 
> this simulation, I assume the layout but perhaps a model as well as 
> the materials. We have been working with the Engineering group and 
> presently we have identified the thermal conducting elements to be 
> copper, but we are also interested in aluminum as perhaps an 
> alternative. In addition to what you would need to perform this 
> simulation, how much time would you need. We are also working with 
> Michael Merkin of MSU who is in the process developing the base module 
> of the SVT detector. So we are a bit short on time. Let me know if 
> theres anything I could do to help this along.
>
> Thanks
> Marc McMullen
>
> Saptarshi Mandal wrote:
>> Hi Marc,
>>
>> I spoke to Dave about the multiple scattering from the copper heat 
>> sink insert. He wanted to know if there was any kind of simulation 
>> done to study the effect of multiple scattering on MicroMegas/SVT due 
>> to the copper.
>>
>>
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