[Hbi-svt] Multiple scattering from copper

[Marc McMullen]

Hi All,

Amrit has looked at Dave's suggested layout and would like to consider 
the possible benefits of  reducing  region 2 to two sensors, and even 
the possibility of having all regions using two sets of sensors. Where 
this will limit the backward angle coverage, less silicon should improve 
the signal to noise ratio as well as giving the option of aligning the 
regions to reduce the effects of multiple scattering. In addition to the 
advantages mechanically which Dave has stated, by using reduced a length 
BST design it may be possible to shift the position of the BST to 
accommodate greater backward angle coverage (if need be, due to the 
needs of different experiments). Perhaps this may be made possible by 
the ability to switch out a length of pipe during a configuration 
change...but perhaps I am getting ahead of myself, perhaps.

I have requested Maurizio's help in to do some simulations on these (at 
least 4 at this point) layouts. He has not replied yet, if anyone knows 
if he is absent or on vacation please let me know. In any case I am sure 
he will let me know something.

Saptarshi is reviewing the two layouts we provided him earlier this 
week, he should be able to tell us about interference with the support 
tube and maybe if the support tube design can be modified to accommodate 
this interference...or if it cannot, due to the restrictions imposed by 
the geometry of the target(s).


Thanks
Marc

David Kashy wrote:
> Hi All,
> I have looked at the two layouts (Rev 4 and Rev 5 of the BST Layout) 
> Just using a ruler, it seems there is another option that should be 
> simulated. If we take the two wafer design from Rev 4 inner layer and 
> use it for R2 then we get the most compact BST. This gives the most 
> rigid device since R1 and R2 are both short. R3 must be long, or we 
> loose too much acceptance. It may be that we dont' quite get to 124 
> degrees, but I'm not sure if this is a requirement.
>
> So can we simulate the effect of having copper very close to the 124 
> degree line as a 3rd case.
>
> Thanks
> Dave
>
>
> Marc McMullen wrote:
>> Hi Maurizio,
>>
>> I have a couple of questions concerning simulating the effects of 
>> different cooling materials as it pertains to the multiple scattering 
>> (M.S.) effect on the central detector components. We would like to 
>> have a material which will both efficiently remove the heat load 
>> produced by the ASICs of the SVT and while minimizing M.S. effect.  
>> Amrit  has pointed me in your direction. What would you need to do 
>> this simulation, I assume the layout but perhaps a model as well as 
>> the materials. We have been working with the Engineering group and 
>> presently we have identified the thermal conducting elements to be 
>> copper, but we are also interested in aluminum as perhaps an 
>> alternative. In addition to what you would need to perform this 
>> simulation, how much time would you need. We are also working with 
>> Michael Merkin of MSU who is in the process developing the base 
>> module of the SVT detector. So we are a bit short on time. Let me 
>> know if theres anything I could do to help this along.
>>
>> Thanks
>> Marc McMullen
>>
>> Saptarshi Mandal wrote:
>>> Hi Marc,
>>>
>>> I spoke to Dave about the multiple scattering from the copper heat 
>>> sink insert. He wanted to know if there was any kind of simulation 
>>> done to study the effect of multiple scattering on MicroMegas/SVT 
>>> due to the copper.
>>>
>>>
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