[Hbi-svt] Fwd: PA_JLab_v3.gds

[Brian Eng]

Web link for mask files (use the 7-22 ones): http://clasweb.jlab.org/instrumentation/SVT/CAD/pitch_adapter/

I've also attached a zip file (since I'm not sure what off-site access is like) and inside you'll find the following files:

PA_7-22.gds - original mask file
PA_7-22.dxf - DXF conversion of mask file by KLayout
PA_7-22.dwg - DWG conversion by AutoCAD 2011 (in 2007 format)
PA_mockup3.dxf - AutoCAD file with the H sensor, PA and top hybrid of HFCB placed via fiducial alignment.

Just as a FYI the X-offsets of pad centers are the following: Sensor pads = 0.0000 microns, Left chip = 0.0005 microns, Right chip = 0.0003 microns, i.e. small enough to consider exactly aligned.

I hope that by Wednesday next week at the latest we'll have either approved this design as final or found some critical errors that require more changes.

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Begin forwarded message:

> From: Miguel Ullan <miguel.ullan at imb-cnm.csic.es>
> Date: July 22, 2011 1:59:25 PM EDT
> To: Brian Eng <beng at jlab.org>
> Subject: PA_JLab_v3.gds
> 
> Hello Brian,
> 
> Find attached the next version of the PA.
> 
> Regards,
> 
> Miguel.
> 
> 
> -- 
> ------------------------------------------------------
> Miguel Ullan
> 
> Centro Nacional de Microelectr?nica (IMB-CNM,CSIC)
> Campus Universitario Bellaterra
> 08193 Barcelona
> SPAIN
> Tf: + 34 93 594 7700 ext. 2203
> Fax: + 34 93 580 1496
> Miguel.Ullan at imb-cnm.csic.es
> http://www.cnm.es/
> ------------------------------------------------------
>