[Hbi-svt] Fwd: new design, new version

[Brian Eng]

Hi,

After talking with Greg, I decided that instead of simply making one of the metal fills bondable it would be more obvious to have a separate test bond area.

This should be the only change since the prior version (which for reference was 2012-05-11).

The new design files start with 2012-06-12 in this folder: http://clasweb.jlab.org/instrumentation/SVT/CAD/pitch_adapter/

Please let me know if this design is acceptable ASAP so we can release the design to CNM to begin manufacture.

Thanks
Brian

Begin forwarded message:

> From: Miguel Ullan <miguel.ullan at imb-cnm.csic.es>
> Date: June 12, 2012 7:11:16 AM EDT
> To: Brian Eng <beng at jlab.org>
> Subject: Re: new design, new version
> 
> Hi Brian,
> 
> Please, find attached the next version of the PA. Passivation opening is inserted 5 microns in the central metal rectangle for technological needs.
> 
> Cheers,
> 
> Miguel.