[Dsg-rich] RICH electronics assembly

[Tyler Lemon]

Hello Valery, 

I have some questions regarding your previous email. My questions are in-line below in blue. Thank you in advance for your clarifications. 

Hello Tyler, 

The detailed procedure of the electronics assembly will be sent to you by Marco Mirazita. 
I would like to inform you that the front-end electronics itself is not ready yet. 
It will arrive to Jlab in March I guess. Then we are going to test the electronics board together with 
MAPMTs at our laser stand. It will take another month. 
However we can start the electronics board assembly in parallel with test. 

1. Could it be estimated that the above will be complete at the end of April 2017 or beginning of May 2017? 

We still have to buy HV and LV power supply, cables, as well as DAQ crate, boards etc. 
So the timeline for the complete RICH electronics assembly is not determined yet. 

2. Is there any time estimate as to when the procurement for these will go through? 

The operation of the electronics at the EEL 124 is described in the RICH OSP. 

We will need the cooling system when all electronics boards will be assembled. 
Before that we still have the possibility to test part of the electronics when power consumption is not high. 

3. Considering the above, it seems that the cooling system won't be needed until we have the HV/LV power supply. Will the cooling system only be required after the electronics are connected to HV/LV? 

The operation of the completely assembled RICH at the EEL 124 is described in the RICH OSP 

Best regards, 
Tyler 




From: "Tyler Lemon" <tlemon at jlab.org> 
To: "dsg-rich" <dsg-rich at jlab.org> 
Sent: Wednesday, March 8, 2017 3:03:07 PM 
Subject: [Dsg-rich] RICH electronics assembly 




BQ_BEGIN

Hello Marco Contalbrigo and Valery, 

In today's DSG meeting, Dario and Sandro informed us that a shipment containing the electronic panel assembly support should be expected next week (week of 3/13/2017). After its arrival, they mentioned that the electronics will be assembled and tested on the electronic panel. 

Has the required safety documentation (OSP, TOSP, BList, or other) for the electronic tests been generated? 

I can see on the OSP webpage that there is a signed Laser OSP titled "LOSP for RICH PMT test stand" submitted by Valery. Does this cover the electronics assembly and testing to be done in EEL 124? If not, we would need the information below to be able to write the documentation: 

1.) Detailed procedure for electronics assembly. 
2.) Cost of electronics and electronics panel. 
3.) Timeline for assembly of electronics. 

In addition, would the tests require the air cooling system? The RICH Air Cooling system is still pending JLab design authority approval and could be done in one to two months if needed. 

Please let us know so we can generate the required safety documentation (if needed) as soon as possible. 

Best regards, 
Tyler 


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BQ_END


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