[Dsg-rich] RICH electronics assembly

[Valery Kubarovsky]

Hi Tyler, 

> The detailed procedure of the electronics assembly will be sent to you by Marco
> Mirazita.
> I would like to inform you that the front-end electronics itself is not ready
> yet.
> It will arrive to Jlab in March I guess. Then we are going to test the
> electronics board together with
> MAPMTs at our laser stand. It will take another month.
> However we can start the electronics board assembly in parallel with the test.

> 1. Could it be estimated that the above will be complete at the end of April
> 2017 or beginning of May 2017?

Yes, the panel with front-end electronics and multiAnode PMTs will be completely assembled not sooner than beginning of May, 2017. 

> We still have to buy HV and LV power supply, cables, as well as DAQ crate,
> boards etc.
> So the timeline for the complete RICH electronics assembly is not determined
> yet.

> 2. Is there any time estimate as to when the procurement for these will go
> through?

It is the question for Patrizia. PRs are ready. We are waiting for money. 
At the same time we have plan to borrow the DAQ crate and part of the DAQ electronics from Chris. 
So we will have the possibility to start the DAQ test before the procurement will go through. 

3. Considering the above, it seems that the cooling system won't be needed until we have the HV/LV power supply. Will the cooling system only be required after the electronics are connected to HV/LV? 

The cooling system is required only in the case if Low Voltage is ON. 
The partial test of the system can be done without cooling system. 

Regards, 
Valery 

From: "Tyler Lemon" <tlemon at jlab.org> 
To: "dsg-rich" <dsg-rich at jlab.org> 
Sent: Wednesday, March 8, 2017 3:03:07 PM 
Subject: [Dsg-rich] RICH electronics assembly 
Hello Marco Contalbrigo and Valery, 

In today's DSG meeting, Dario and Sandro informed us that a shipment containing the electronic panel assembly support should be expected next week (week of 3/13/2017). After its arrival, they mentioned that the electronics will be assembled and tested on the electronic panel. 

Has the required safety documentation (OSP, TOSP, BList, or other) for the electronic tests been generated? 

I can see on the OSP webpage that there is a signed Laser OSP titled "LOSP for RICH PMT test stand" submitted by Valery. Does this cover the electronics assembly and testing to be done in EEL 124? If not, we would need the information below to be able to write the documentation: 

1.) Detailed procedure for electronics assembly. 
2.) Cost of electronics and electronics panel. 
3.) Timeline for assembly of electronics. 

In addition, would the tests require the air cooling system? The RICH Air Cooling system is still pending JLab design authority approval and could be done in one to two months if needed. 

Please let us know so we can generate the required safety documentation (if needed) as soon as possible. 

Best regards, 
Tyler 

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